Reylong at PACK EXPO International 2026 — Chicago, October 18–21

Reylong will participate in PACK EXPO International 2026, the largest packaging and processing trade show in the Western Hemisphere, held October 18–21, 2026 at McCormick Place in Chicago, Illinois.

PACK EXPO International brings together over 2,600 exhibitors and 48,000 packaging professionals from more than 40 industries — the definitive platform for connecting with North American buyers and distributors.

Why PACK EXPO International

2,600+ exhibitors across the entire packaging value chain
48,000+ professionals from food & beverage, pharma, industrial, and consumer goods sectors
Strong focus on automation, robotics, and AI-driven packaging solutions in 2026

Meet Our Team

Visit the Reylong booth to learn about our woven bag machinery, stand-up zipper pouch equipment, and flexographic printing solutions. Our engineers are available to discuss your specific production requirements.

Event Details

Dates: October 18–21, 2026
Venue: McCormick Place, Chicago, IL, USA

To schedule a meeting ahead of the show, contact us here.